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Silicone Thermal Conductive Gap Filler Pad could reach 16.0 W/mk Between heat-generation Component and heatsink Automotive engine control, Graphices Cards, Telecom device Wireless Hub,Military equipment, power supply Cooling Module, Thermal module,
1. High bond strength to surfaces
2. Thermal conductivity in combination with electrical isolation
3. Excellent wet out
4. High temperature stability
Application:
1.For CPU, LED,PPR heat sink, microprocessor
2.For any power consumption semiconductor
2.Replacing screws, fasteners and other fixed means
4.Fixing heat sink on the power supply circuit board
5.Fixing heat sink on vehicle control circuit board
6.Fixing heat sink on packaged chips
we could die cut any size and shapes as customer design.
TP-1600
|
TEST ITEM |
TEST MOTHOD |
UNIT |
VALUE |
|
SIZE |
|
mm |
400*200MM |
|
COLOR |
Visual |
|
Blue |
|
THICKNESS |
ASTM D374 |
mm |
0.3-10MM |
|
GRAVITY |
ASTM D792 |
g/cc |
2.85±0.1 |
|
HARDNESS |
ASTM D2240 |
Shore 00 |
25±5 |
|
TENSILE STRENGTH |
ASTM D412 |
kg/cm2 |
55 |
|
|
|
|
|
|
ELONGATION |
ASTM D412 |
% |
60 95 |
|
TEMP |
EN344 |
℃ |
-40～+220 |
|
VOLUME RESISTIVITY |
ASTM D257 |
Ω•CM |
3.1*1011 |
|
BREAKDOWN VOLTAGE |
ASTM D149 |
kv/mm |
5 |
|
VOLUME IMPENDENCE |
ASTM D257 |
Ω.cm |
1.7×1013 |
|
Weight Damnify |
200℃ 200H |
% |
≤1 |
|
Thermal Resistance |
ASTM D5740 |
℃/ W |
0.18 |
|
FLAMMABLITY |
UL-94 |
|
V-0 |
|
THERMAL CONDUCTIVITY |
ASTM D5470 |
w/(m•k) |
16 |
